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Teccor(R) brand Protection Thyristors
Surface Mount
Q2L Series (C-Rated) SIDACtor(R) Device
Description The Q2L SIDACtor series provides bidirectional transient voltage protection in a low profile, chip scale package (CSP). The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.
Features * RoHS compliant * Chip Scale Package (CSP) sizing * Wide range of IPP ratings including: 500A for 2x10s GR 1089 waveform 200A for 5x310/10x700s ITU/YDT waveform 100A for 10x1000s GR 1089 waveform 150A for 10x560s TIA-968-A * Bidirectional transient voltage protection * Small footprint (QFN) * Teccor brand SIDACtor technology
Agency Approvals
AGENCY AGENCY FILE NUMBER E133083
Protection solution to meet * * * * YD/T 950 YD/T 993 YD/T 1082 GR 1089 * IEC 61000-4-5 * ITU K.20/21 * TIA-968-A
Electrical Characteristics
VDRM @ldrm=5A Volts Min P0080Q22CLRP P0300Q22CLRP P0640Q22CLRP P0720Q22CLRP P0900Q22CLRP P1100Q22CLRP P1300Q22CLRP P1500Q22CLRP P1800Q22CLRP P2300Q22CLRP P2600Q22CLRP P3100Q22CLRP P3500Q22CLRP P-8C P03C P06C P07C P09C P11C P13C P15C P18C P23C P26C P31C P35C 6 25 58 65 75 90 120 140 170 190 220 275 320 VS @100V/s Volts Max 25 40 77 88 98 130 160 180 220 260 300 350 400 IH IS IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 VT @IT=1 amp Volts Max 800 800 800 800 800 800 800 800 800 800 800 800 800 5 5 5 5 5 5 5 5 5 5 5 5 5 Min 35 25 55 50 45 45 40 35 35 30 30 30 25 Capacitance @1MHz, 2V bias pF Max 75 45 85 75 70 70 60 55 50 50 45 45 40
Part Number
Marking
mAmps mAmps Min 50 50 150 150 150 150 150 150 150 150 150 150 150
* All measurements are made at an ambient temperature of 25C. IPP applies to -40C through +85C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. Q2L (C-Rated) Series Specifications are subject to change without notice.
* Listed SIDACtor devices are bidirectional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VS is measured at 100 V/s. * Off-state capacitance is measured at 1MHz with a 2 V bias.
Telecom Design Guide
www.littelfuse.com (c)2006 Littelfuse
Teccor(R) brand Protection Thyristors
Surface Mount
Surge Ratings
Ipp Series 2x10s Amps Min C 500 1.2x50s/8x20s Amps Min 400 10x160s Amps Min 200 10x560s Amps Min 150 10x1000s Amps Min 100 Amps/s Max 500 di/dt
Thermal Considerations
Package
QFN
Symbol TJ TS
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 120
Unit C C C/W
PIN 1
PIN 2
RuJA
V-I Characteristics
+I
tr x td Pulse Waveform
IPP - Peak Pulse Current - %IPP
IT IS IH -V IDRM VT VDRM VS +V
100
Peak Value
tr = rise time to peak value td = decay time to half value
Waveform = tr x td 50
Half Value
0 0
tr
td
-I
t - Time (s)
Normalized VS Change Versus Junction Temperature
Normalized DC Holding Current Versus Case Temperature
Percent of VS Change - %
10 8 6 4 2 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160 0
IH (TC = 25 C)
14 12
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0
IH
25 C
25 C
Ratio of
Junction Temperature (TJ) - C
Case Temperature (TC) - C
20 40 60 80 100 120 140 160
Q2L (C-Rated) Series Specifications are subject to change without notice.
2 Telecom Design Guide
www.littelfuse.com (c)2006 Littelfuse
Teccor(R) brand Protection Thyristors
Surface Mount
Soldering Parameters
260 220 Temperature (C)
Liquidus
190 150
Soak Stage
0
50 to 150
60 to 90 Time(s)
120
Physical Specifications
Terminal Material Lead Solderability Matte Tin-plated Copper ANSI/J-STD-002
Environmental Specifications
Operating/Storage Temperature Passive Aging Humidity Aging -40 C to ~ +150C 125 C, 1000 hours Meet Spec +85C, 85% R.H. 1000 hours Meet Spec MIL-STD-202 Method 107G +85C/-40C 100 times Meet spec MIL-STD-202, Method 215 No Change MIL-STD-883C, Method 2007.1, Condition A No Change
Can be A or B
Can be A or B
Thermal Shock
Solvent Resistance
Vibration
TOP VIEW
A J
BOTTOM VIEW
C E
Dimensions
B
TOP VIEW
A J
BOTTOM VIEW
C E
F
Dimensions
1.50 (.059") 2.54 (.100")
Inches Min 0.126 0.126 0.075 0.011 0.088 0.035 0.000 0.004 0.004 0.063 0.045 0.095 0.082 Typ 0.130 0.130 0.079 0.015 0.092 0.039 0.004 0.008 0.008 0.067 0.049 0.099 0.086 Max 0.134 0.134 0.083 0.019 0.096 0.043 0.008 0.012 0.012 0.071 0.053 0.103 0.090 Min 3.200 3.200 1.900 0.285 2.230 0.900 0.000 0.100 0.100 1.610 1.153 2.420 2.080
Millimeters Typ 3.300 3.300 2.000 0.385 2.330 1.000 0.100 0.200 0.200 1.710 1.253 2.520 2.180 Max 3.400 3.400 2.100 0.485 2.430 1.100 0.200 0.300 0.300 1.810 1.353 2.620 2.280
END VIEW
B
H
SIDE VIEW
M1 M2
F
A B C E F H J K1 K2 M1 M2 N1 N2
1.27 (.050") N2 N1 K1
H
K2
1.50 (.059") 1.27 (.050")
END VIEW
SIDE VIEW
M1 M2
Recommended (.100") Soldering Pad Outline (Reference Only)
*Reference Tech Brief (EC642) for soldering recommendations Recommended
2.54
N2 N1
K1
K2
Soldering Pad Outline (Reference Only)
Q2L (C-Rated) Series Specifications are subject to change without notice.
Telecom Design Guide
www.littelfuse.com (c)2006 Littelfuse
Teccor(R) brand Protection Thyristors
Surface Mount
Part Marking System
Part Numbering System
Pxxx0Q22CLRP
First Line: Product Name (see marking in table) Second Line: Lot number
DEVICE TYPE P : SIDACtor MEDIAN VOLTAGE xxx : xxx volts CONSTRUCTION VARIATION 0 : Single SIDACtor chip used as a single device
PACKING STYLE RP : Standard: Embossed carrier tape and reel per EIA 481-1, 12mm tape in 13" reel, 5,000 pieces per reel L : RoHS Compliant SURGE Ipp Rating C : 500AMP 2x10s 100AMP 10x1000s PACKAGE TYPE Q22 : QFN, 3.3mm x 3.3mm, two leaded package
Packaging
Package Type QFN Description Embossed Carrier Reel Pack Packing Quantity 5000 Added Suffix RP Industry Standard EIA-481-1
Tape and Reel Specification
Symbols
N B
C A D W1 N
C A D W1
Description Reel Diameter Drive Spoke Width Arbor Hole Diameter Drive Spoke Diameter Hub Diameter Reel Inner Width at Hub Pocket Width at bottom Pocket Length at bottom Feed Hole Diameter Pocket Hole Diameter Feed hole position 1 Feed hole position 2 Feed hole center-Pocket hole Pocket Depth Feed Hole Pitch Component Spacing Feed hole center-Pocket hole Carrier Tape Thickness Embossed Carrier Tape Width Cover Tape Width
Inches Minimum N/A 0.059 0.504 0.795 1.969 0.488 0.138 0.138 0.059 0.059 0.065 0.400 0.215 0.039 0.153 0.311 0.077 0.010 0.453 0.358 Maximum 12.992 N/A 0.531 N/A N/A 0.567 0.146 0.146 0.063 N/A 0.073 0.408 0.219 0.051 0.161 0.319 0.081 0.014 0.484 0.366
Millimeters Minimum N/A 1.50 12.80 20.20 50.00 12.40 3.50 3.50 1.50 1.50 1.65 10.15 5.45 1.00 3.90 7.90 1.95 0.25 11.50 9.10 Maximum 330.0 N/A 13.50 N/A N/A 14.40 3.70 3.70 1.60 N/A 1.85 10.35 5.55 1.30 4.10 8.10 2.05 0.35 12.30 9.30
A B C D N W1 CARRIER TAPE E1 A0
B0 F
Reel DimensionB
Reel Dimension
D0
D0 P0 P2
T
T
P0 P2
D1
D1
CARRIER TAPE E1
W0 K0
K0
COVER TAPE P1
COVER TAPE
B0 E2 W D0 D1 E1 E2
B0
F
W0
E2 W
P1
A0
A0
TapeDimension Items Tape Dimension Items
CARRIER TAPE
COVER TAPE
END
CARRIER TAPE
COVER TAPE
END
START
F K0 P0 P1 P2 T W W0
START
LEADER 400mm MIN
TRAILER 160mm MIN
TRAILER Tape 160mmand Trailer Dimensions Leader MIN
LEADER 400mm MIN
Tape Leader and Trailer Dimensions
Q2L (C-Rated) Series Specifications are subject to change without notice.
Telecom Design Guide
www.littelfuse.com (c)2006 Littelfuse

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